| VAV Specifications | UQDB02 | UQDB04 | UQDB06 | UQDB08 |
| Cv | 0.42 | 1.33 | 2.4 | 4.78 |
| Max working pressure | 16.5Bar | 16.5Bar | 16.5Bar | 16.5Bar |
| Min. burst pressure | 50 Bar | 50 Bar | 45 Bar | 45 Bar |
| Working Temperature | -40℃~125℃ | -40℃~125℃ | -40℃~125℃ | -40℃~125℃ |
| Socket Material | SUS316 | SUS316 | SUS316 | SUS316 |
| Plug Material | SUS316 | SUS316 | SUS316 | SUS316 |
| Seal Material | EPDM | EPDM | EPDM | EPDM |
For more detail, please click here UQDB series
UQD: A Unified Solution for Liquid Cooling in Data Centers
The Universal Quick Disconnect (UQD) is a next-generation fluid connector designed to simplify and standardize liquid cooling infrastructure in data centers. Originally championed by Intel and now part of the Open Compute Project (OCP) standard, UQD offers a robust, leak-free connection solution that enables safe, hot-swappable coolant line handling—no system shutdown required.
With the rise of high-density computing for applications like HPC and AI, efficient thermal management is more critical than ever. UQD connectors address this challenge by providing high flow performance, minimal pressure drop, and full interoperability across OCP-compliant systems.
Why UQD?
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Fully meets OCP interoperability and performance standards
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Fast, intuitive, tool-less operation
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Seamlessly compatible with other OCP UQD connectors
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Offered in a range of sizes and materials to fit diverse system needs
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Built for durability and repeated use in demanding environments
Trusted by global manufacturers including CPC, CEJN, and Stäubli, UQD is shaping the future of liquid cooling by offering a modular, scalable, and service-friendly approach—accelerating deployment and maximizing uptime for modern data centers.